A Peltier module, also known as a thermoelectric cooler (TEC) or thermoelectric module (TEM), is a semiconductor device that plays a crucial role in thermoelectric cooling. It is based on the Peltier effect, which is the phenomenon of heat absorption or release at the junction of two dissimilar materials when an electric current is passed through them.
The primary purpose of a Peltier module in thermoelectric cooling is to transfer heat from one side of the module to the other, creating a cooling effect on one side and a heating effect on the other side. The Peltier module consists of two semiconductor layers, typically made of bismuth telluride or other thermoelectric materials, sandwiched between two ceramic plates or substrates.
Here's how the Peltier module works for thermoelectric cooling:
Electric Current Application: When a direct current (DC) is applied to the Peltier module, it creates a flow of electrons through the semiconductor layers.
Heat Absorption and Release: At the junction where the two semiconductor layers meet, heat is either absorbed or released, depending on the direction of the electric current. This means that one side of the module becomes cold while the other side becomes hot.
Heat Transfer: The absorbed heat from the cooled side is then transferred to the hot side of the module.
Heat Sink and Cooling: To maintain the cooling effect on one side, a heat sink is typically attached to dissipate the absorbed heat from the cooled side effectively.
Cooling Application: The cooled side of the Peltier module can be used to cool electronic components, optical devices, or any other applications where localized cooling is required.
It's essential to note that while Peltier modules can achieve localized cooling, they are not as efficient as traditional refrigeration methods (e.g., compressor-based cooling systems) in large-scale cooling applications. Peltier modules are more commonly used in smaller cooling systems or applications where precise and compact cooling is necessary. Additionally, their efficiency is influenced by factors such as the current applied, temperature differences, and the thermal properties of the materials used in the module.